Jiangsu Profile
Product List
6676. Customized Mirror Polish Si3n4 Silicon Nitride Ceramic Tube Sleeve 
[Oct 09, 2025]
[Oct 09, 2025] Product Description Silicon Nitride Si3N4 Ceramic Silicon nitride is a man-made compound synthesized through several different chemical reaction methods. Product Name Corrosion Resistance Molten Aluminum Silicon ...
6677. Advanced UV Laser Marking Machine for PCBA, IC, and Wafer [Oct 27, 2025]
[Oct 27, 2025] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
6678. Precision Automatic Glass Laser Scribing Machine for Mobile Devices [Oct 28, 2025]
[Oct 28, 2025] Product Description Model NO. Himalaya-6688-008 Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Mould Life >1,000,000 ...
6679. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Oct 24, 2025]
[Oct 24, 2025] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure uniform ...
6680. 20W-100W Fiber Laser Marking Machine for Metal & Plastic with Ezcad2 Software [Oct 24, 2025]
[Oct 24, 2025] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on a ...
6681. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Oct 22, 2025]
[Oct 22, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
6682. 20W Fiber Laser Marking Machine Engraving for Semiconductor PCB Uid Marking [Oct 22, 2025]
[Oct 22, 2025] Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...
6683. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Oct 22, 2025]
[Oct 22, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
6684. Factory Price Fiber Laser Marking/Engraving Machine for PVC Steel Aluminum Brass Plastic [Oct 22, 2025]
[Oct 22, 2025] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on a ...
6685. Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing [Oct 20, 2025]
[Oct 20, 2025] Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...
6686. High-Quality S355jr Hydraulic Thrust Roller for Rotary Kiln [Sep 26, 2025]
[Sep 26, 2025] Name:Hot forging s355jr Q345 S235jr 5140 hydraulic thrust roller for rotary kiln We are the manufacturer specialized in machining heavy duty forging parts for nearly 18 years.Our products, such as drive shaft, ...
6687. 5W Flying Marking Machine for PE Bottle/PVC Pipe/Ceramics/Gift/Decorative/Package Bag [Oct 16, 2025]
[Oct 16, 2025] Product Description Brief Description UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like: plastic, PE Bottle, package bag, PVC pipe line, etc. ...
6688. 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer [Oct 16, 2025]
[Oct 16, 2025] Product Description High-Precision Laser Scribing Machine for Superior Wafer Yield Our SHL2-4000V19 Laser Scribing Machine represents the pinnacle of efficiency and precision in solar cell production. Designed for ...
6689. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Oct 16, 2025]
[Oct 16, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
6690. Laser Industry-Leading Laser Wafer Marking for Semiconductor & Mems Manufacturingafer Marking ... [Oct 16, 2025]
[Oct 16, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
