Jiangsu Profile
Product List
6736. Super Fine UV Laser Marking Machine for 355nm Wavelength 
[Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6737. High Precision UV Laser Marking Machine for Silicon Wafer Drilling [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6738. Advanced Infrared Picosecond Laser Cutting Machine for Sapphire Glass Sensor [Jul 14, 2026]
[Jul 14, 2026] Advanced Infrared Picosecond Laser Cutting Machine for Sapphire Glass Sensor CHANXAN delivers professional integrated infrared picosecond ultrafast laser precision processing solutions tailored for sensor glass, ...
6739. High Precision UV Picosecond Laser Machine with Marble Platform for FPC PCB [Jul 14, 2026]
[Jul 14, 2026] High Precision UV Picosecond Laser Machine with Marble Platform for FPC PCB CHANXAN provides professional UV picosecond laser cutting machines for the 3C electronics industry, including FPC flexible circuits, thin PCB ...
6740. High-Performance 3kw CNC Fiber Laser Cutting Machine for Pipes [Jul 16, 2026]
[Jul 16, 2026] Detailed Photos Product Parameters UT1530FL300 LASER CUTTING MACHINE Working size 1500*3000mm Machine size 2170*1900*4500 mm System Ncstudio Laser power Max 3000W MFSC3000X Transmission system Taiwan brand ...
Company: Nanjing Unitec Technology Co., Ltd.
6741. High-Performance Fiber Laser Cutting Machine for Metal Sheets [Jul 16, 2026]
[Jul 16, 2026] Detailed Photos MAIN PARTS Machine Bed Steel Pipe Welded Fiber Laser Source ,Max Cutting Head Raytools brand BT220-2D Ncstudio Servo Motor and ...
Company: Nanjing Unitec Technology Co., Ltd.
6742. Factory Infrared Picosecond Laser Cutting Machine for Sensor Glass Sapphire CE Certified [Jul 14, 2026]
[Jul 14, 2026] Factory Infrared Picosecond Laser Cutting Machine for Sensor Glass Sapphire CE Certified CHANXAN delivers professional IR picosecond cold laser precision processing solutions for automotive optical glass and ...
6743. Factory Chanxan UV Picosecond Laser Cutting Machine for FPC PCB CE Certified [Jul 14, 2026]
[Jul 14, 2026] Factory CHANXAN UV Picosecond Laser Cutting Machine for FPC PCB CE Certified CHANXAN delivers professional UV picosecond ultrafast laser precision processing solutions for 3C electronics, covering core processes ...
6744. Professional Laser Engraving Machine for Unique Jewelry Designs [Jul 15, 2026]
[Jul 15, 2026] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable ...
6745. Factory Chanxan Picosecond Ultrafast Laser Cutting Machine for Glass Sapphire CE Certified [Jul 13, 2026]
[Jul 13, 2026] Factory CHANXAN Picosecond Ultrafast Laser Cutting Machine for Glass Sapphire CE Certified CHANXAN provides professional integrated ultrafast laser precision processing solutions for optical glass, sapphire wafer, 3C ...
6746. Factory Femtosecond Laser Cutting Machine for FPC PCB Flexible Film CE Certified [Jul 13, 2026]
[Jul 13, 2026] Factory Femtosecond Laser Cutting Machine for FPC PCB Flexible Film CE Certified CHANXAN femtosecond ultrafast laser cutting machines fully meet strict precision and high yield standards for consumer 3C electronics, ...
6747. Premium Virgin PTFE Cleaning Basket for Semiconductor Wafer Processing [Jul 13, 2026]
[Jul 13, 2026] Product Description Technical Index Unit Value Specific Gravity g/cc 2.15-2.20 Tensile Strength Pa (1,961-3,521)x 10000 Elongation at Break % 250-500 Compressive Strength (10% deformation) Pa 19.52 x1000000 Impact ...
Company: Zhenjiang Hansa Sealant Co., Ltd.
6748. High-Precision GaN Wafer Laser Dicing System for Semiconductors [Jul 13, 2026]
[Jul 13, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
6749. Advanced Grinding Technologies for Precision Wafer Thinning Processes [Jul 13, 2026]
[Jul 13, 2026] Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the ...
6750. Factory RF CO2 Laser Cutting Machine for FPC PCB Flexible Film CE [Jul 13, 2026]
[Jul 13, 2026] Factory RF CO2 Laser Cutting Machine for FPC PCB Flexible Film CE CHANXAN RF CO2 laser cutting machines perfectly meet strict precision and yield standards for consumer 3C electronics, including mobile phones, wearable ...
