Jiangsu Profile
Product List
6691. Ultra Fine UV Laser Marking Machine for LCD Glass Marking 
[Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6692. Ultra Precision UV Laser Marking Machine for Micro Processing [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6693. High Accuracy UV Laser Marking Machine for FPC PCB Marking [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6694. Super Fine UV Laser Marking Machine for 355nm Wavelength [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6695. High Precision UV Laser Marking Machine for Silicon Wafer Drilling [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6696. Advanced Infrared Picosecond Laser Cutting Machine for Sapphire Glass Sensor [Jul 14, 2026]
[Jul 14, 2026] Advanced Infrared Picosecond Laser Cutting Machine for Sapphire Glass Sensor CHANXAN delivers professional integrated infrared picosecond ultrafast laser precision processing solutions tailored for sensor glass, ...
6697. High Precision UV Picosecond Laser Machine with Marble Platform for FPC PCB [Jul 14, 2026]
[Jul 14, 2026] High Precision UV Picosecond Laser Machine with Marble Platform for FPC PCB CHANXAN provides professional UV picosecond laser cutting machines for the 3C electronics industry, including FPC flexible circuits, thin PCB ...
6698. Factory Infrared Picosecond Laser Cutting Machine for Sensor Glass Sapphire CE Certified [Jul 14, 2026]
[Jul 14, 2026] Factory Infrared Picosecond Laser Cutting Machine for Sensor Glass Sapphire CE Certified CHANXAN delivers professional IR picosecond cold laser precision processing solutions for automotive optical glass and ...
6699. Factory Chanxan UV Picosecond Laser Cutting Machine for FPC PCB CE Certified [Jul 14, 2026]
[Jul 14, 2026] Factory CHANXAN UV Picosecond Laser Cutting Machine for FPC PCB CE Certified CHANXAN delivers professional UV picosecond ultrafast laser precision processing solutions for 3C electronics, covering core processes ...
6700. Professional Laser Engraving Machine for Unique Jewelry Designs [Jul 15, 2026]
[Jul 15, 2026] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable ...
6701. Mr Carve A1 UV Laser Marking Machine Marked on Metal Glass [Jun 29, 2026]
[Jun 29, 2026] Product Description Mr carve Daja A1 UV Laser Marking Machine has a High Speed 10000mm/S Features: [High precision, clear marking]the UV fiber optic marking machine adopts advanced laser technology, capable of producing ...
Company: Suzhou Tophee Tech Co., Ltd.
6702. Factory Femtosecond Laser Cutting Machine for FPC PCB Flexible Film CE Certified [Jul 13, 2026]
[Jul 13, 2026] Factory Femtosecond Laser Cutting Machine for FPC PCB Flexible Film CE Certified CHANXAN femtosecond ultrafast laser cutting machines fully meet strict precision and high yield standards for consumer 3C electronics, ...
6703. Premium Virgin PTFE Cleaning Basket for Semiconductor Wafer Processing [Jul 13, 2026]
[Jul 13, 2026] Product Description Technical Index Unit Value Specific Gravity g/cc 2.15-2.20 Tensile Strength Pa (1,961-3,521)x 10000 Elongation at Break % 250-500 Compressive Strength (10% deformation) Pa 19.52 x1000000 Impact ...
Company: Zhenjiang Hansa Sealant Co., Ltd.
6704. Advanced Grinding Technologies for Precision Wafer Thinning Processes [Jul 13, 2026]
[Jul 13, 2026] Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the ...
6705. High-Precision UV Laser Cutter for OLED Film Manufacturing [Jul 13, 2026]
[Jul 13, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, ...
